Archives: Episode
Podcast EP291: The Journey From One Micron to Edge AI at One Nanometer with Ceva’s Moshe Sheier
Dan is joined by Moshe Sheier, Ceva’s vice president of marketing. Moshe brings with him more than 20 years of experience in the semiconductor IP and chip industries in both development and managerial roles. Prior to this position, Mr. Sheier was the director of strategic marketing at Ceva.
Dan explores the history of Ceva with … Read More
Video EP8: How Defacto Technologies Helps Customers Build Complex SoC Designs
In this episode of the Semiconductor Insiders video series, Dan is joined by Chouki Aktouf, CEO and Founder of Defacto Technologies. Dan explores the challenges of building complex SoCs with Chouki, who describes challenges around managing complexity at the front end of the process while staying within PPA requirements and … Read More
Podcast EP290: Navigating the Shift to Quantum Safe Security with PQShield’s Graeme Hickey
Dan is joined by Graeme Hickey, vice president of engineering at PQShield. Graeme has over 25 years of experience in the semiconductor industry creating cryptographic IP and security subsystems for secure products. Formerly of NXP Semiconductor, he was senior manager of the company’s Secure Hardware Subsystems group responsible… Read More
Video EP7: The impact of Undo’s Time Travel Debugging with Greg Law
In this episode of the Semiconductor Insiders video series, Dan is joined by Dr Greg Law, CEO of Undo, He is a C++ debugging expert, well-known conference speaker, and the founder of Undo. Greg explains the history of Undo, initially as a provider of software development and debugging tools for software vendors. He explains that… Read More
Podcast EP289: An Overview of How Highwire Helps to Deliver Advanced Fabs with Less Cost, Time and Risk with David Tibbetts
Dan is joined by David Tibbetts, Chief Safety Officer at Highwire. David is a Certified Safety Professional with 20+ years of occupational safety experience in both general industry and construction settings. He is currently supporting Highwire’s hiring partners utilizing the Highwire suite of software solutions … Read More
Podcast EP288: How Alphawave Semi Enables Next Generation Connectivity with Bharat Tailor
Dan is joined by Bharat Tailor who is responsible for the Alphawave standard connectivity products portfolio focused on DSP chipsets enabling AI data center interconnects. He is a veteran of the high-speed connectivity semiconductor industry having participated in the evolution of connectivity technologies from 10Gbps … Read More
Video EP6: The Benefits of AI Agents for Waveform Debugging with Zackary Glazewski of Alpha Design
In this episode of the Semiconductor Insiders video series, Dan is joined by Zackary Glazewski, an ML Engineer at Alpha Design AI. Dan explores the challenges of waveform debugging with Zack, who explains how the process is done today and the shortcoming of existing approaches. He explains why current approaches are time consuming… Read More
Podcast EP287: Advancing Hardware Security Verification and Assurance with Andreas Kuehlmann
Dan is joined by Dr. Andreas Kuehlmann, Executive Chairman and CEO at Cycuity. He has spent his career across the fields of semiconductor design, software development, and cybersecurity. Prior to joining Cycuity, he helped build a market-leading software security business as head of engineering at Coverity which was acquired… Read More
Video EP5: A Discussion of Photonic Design Challenges and Solutions with Keysight
In this episode of the Semiconductor Insiders video series, Dan is joined by Muhammad Umar Khan, Product Manager for Photonics Design Automation Solutions at Keysight Technologies. Muhammad describes the primary design challenges of photonic design with Dan. These include accurate models and a uniform methodology… Read More
Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli
In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More
Intel Foundry is a Low Risk Aternative to TSMC